Our unique systems approach
Inline processing for printed circuit boards (HDI/MLB and Flex/Flex-Rigid Boards), package substrates, and semiconductor applications
Quick facts
- Unique systems approach: Supplying chemistry, equipment, process know-how, service and spare parts
- Leading sustainable solutions
- Two production sites in Germany and China
Applications
- Printed circuit boards (HDI, MLB, Flex / Flex rigid boards)
- IC substrates
- Advanced packaging
Product portfolio
Permanganate desmear
òòò½ÊÓƵ¡¯ Atotech versatile desmear equipment Uniplate? P allows high throughput rates, from multilayers to thicker boards and HDI boards or bare laminate boards for semi additive processes, giving the best results with almost all available base material (except chemical non-resistant substrates and materials containing acrylic adhesives). More than 450 Uniplate? P lines have been installed for high volume production of MLBs, HDIs and IC substrates for high-end applications such as mSAP/amSAP. It provides the leading transportation capability for thinnest PCB boards going down to 25?m + 2×2?m Cu clad.
Our Uniplate? P has a long successful tradition. Based on this we have developed the next generation ?New Uniplate¡° design which is incorporating all the benefits and advantages of our traditional Uniplate? PLB platform. On top of this, the ?New Uniplate¡° features advances and benefits in reduced footprint, enhanced maintenance and user friendliness, energy consumption reductions, new pump technology and sustainable process control. Following the technology requirements, we improved the fine line capability by adding many sophisticated solutions for particle avoidance and particle reduction.
Equipment highlights:
- High quality stainless steel sweller and permanganate modules ensure maximum process stability and low maintenance.
- Integrated stainless steel filtration system for sweller and permanganate.
- Designed to save resources – highly efficient chemical regeneration system for continuous production at stable process parameters (patented Oxamat? for permanganate regeneration) and sophisticated rinse concept.
- High level of automation and process control combined with the smart use of production data ready for FAB 4.0.
- Strong process performance with with patented flood bar technology.
The P-Line is our new desmear equipment for printed circuit board manufacturers with high reliability and high performance demands in multilayer, rigid-flex and HDI panel processing. The new horizontal line is available in line speeds up to 3.5m/min with to different transportation systems for 24¡° and 28,5¡° wide panels. Polygon Line series features all production-critical characteristics and applies them to a highly reliable, high-volume, and cost-effective machine. The new horizontal line is available in line speeds up to 3.5m/min with to different transportation systems for 24¡° and 28,5¡° wide panels. ?
Equipment highlights:
- Equipped with technology to reduce consumption of water and chemistry (e.g. patented Oxamat for permanganate regeneration, encapsulated modules, minimal bath volumes, multi-stage cascade rinses and condenser units).
- Strong desmear performance with ultra sonic devices for sweller and permanganate.
- The line is available with steam or hot water heating to use existing heat sources at customer site and save electrical energy consumption.
- Strong process performance with patented flood bar technology.
Electroless copper process
The leading horizontal electroless copper plating line, the Uniplate? LB, is the world standard for classical horizontal through-hole metallization. Systems solutions are available for a huge variety of board thicknesses and sizes. More than 405 Uniplate? LB lines have been installed for high volume production of MLBs, HDIs and IC substrates for high-end applications such as mSAP/amSAP. It provides the leading transportation capability for thinnest PCB boards going down to 25?m + 2×2?m Cu clad.
Our Uniplate? LB has a long successful tradition. Based on this we have developed the next generation ?New Uniplate¡° design which is incorporating all the benefits and advantages of our traditional Uniplate? PLB platform. On top of this, the ?New Uniplate¡° features advances and benefits in reduced footprint, enhanced maintenance and user friendliness, energy consumption reductions, new pump technology and sustainable process control. Following the technology requirements, we improved the fine line capability by adding many sophisticated solutions for particle avoidance and particle reduction.
Equipment highlights:
- Superior through hole metallization with patented floodbar technology.
- Highly efficient pump circuits for effective fluid control and efficient energy consumption.
- High level of automation and process control combined with the smart use of production data ready for FAB 4.0.
- Chemistry analyzing system for optimum performance at specific process steps.
The LB-Line is our new electroless copper equipment for printed circuit board manufacturers with high reliability and high performance demands in multilayer, rigid-flex and HDI panel processing. The new horizontal line is available in line speeds up to 3.5m/min with to different transportation systems for 24¡° and 28,5¡° wide panels. The new design provides a highly reliable transportation system with stable and uniform process parameter control in combination with a cost-effective line configuration.
Equipment highlights:
- State-of-the-art throwing power in THs and BMVs due to our patented floodbar technology.
- Automated cup dosing system enables a reliable and maintenance friendly solution.
- The line is available with steam or hot water heating to use existing heat sources at customer site and save electrical energy consumption.
- Semi automatic cleaning with best coverage and reliable cleaning performance.
Direct plating
Uniplate? NP is designed for the Neopact direct plating process and is suitable for all base materials including Teflon.
The Uniplate? CP is the horizontal conveyorized production system to go with our Ecopact conductive polymer direct plating process for HDI, MLB and flex/ flex-rigid productions. This line is compatible with a wide range of base materials.
Equipment highlights:
- Selective process, capable of BMV and direct pattern plating.
- Superior through hole metallization with patented floodbar technology.
- Highly efficient pump circuits for effective fluid control and efficient energy consumption.
- High level of automation and process control combined with the smart use of production data ready for FAB 4.0.
- Low space requirement.
Horizontal electrolytic copper process
More than 1050 Uniplate copper platers? have been purchased from òòò½ÊÓƵ¡¯ Atotech since its release in 1987. Steadily improved from DC to InPulse1 to now Uniplate? Cu InPulse2 (Ip2), our horizontal plating equipment is the cutting edge technology for producing high-end mass products in various applications, such as through hole filling (THF), filling of blind micro vias, and conformal plating.
Equipment highlights:
- Pulse rectifiers for even current distribution and Frequency controlled high current density guaranteeing improved surface quality and uniformity.
- Insoluble anodes for improved geometry.
- Inline filtration for particle reduction.
- High level of automation and process control combined with the smart use of production data ready for FAB 4.0.
Vertical electrolytic copper process
Our new plating solution vPlate? provides customers with best results using advanced manufacturing technologies such as mSAP or SAP and can be applied to various PCB types, ranging from standard multilayer and HDI to advanced HDI, rigid-flex and IC substrates. Uniformities of ¡À10% can be realized leveraging our concept for insoluble segmented anodes with adjustable anode and cathode shielding. Through touch-free transportation of thin panels (down to 36?m + 2¡Á2 Cu clad), we today fulfill all market requirements for vertical continuous copper plating.
Equipment highlights:
- Advanced plating capabilities through insoluble and segmented anodes.
- Best uniformity by adjustable anode and cathode shielding.
- Thin panel transport capability down to down to 36?m + 2¡Á2 Cu clad.
- Flexibility regarding the line layout ¨C adjustable to customer¡¯s space availability and technical specifications.
- Operator-friendly due to full automatic handling, incl. automatic copper & chemistry replenishment.
- Utmost energy and water efficiency by using specialized motors and latest cascade rinsing technology.
Surface treatment / Innerlayer bonding
The Atotech Horizon? Bondfilm ? family is an integrated production solution for bonding enhancement and surface treatment. It consist of Horizon? Bondfilm ? ¨C our intelligent and cost effective solution for improved inner layer bonding and Horizon? Bondfilm ?LDD – a unique process to improve CO2 laser absorption of surfaces prior to laser direct drilling applications at maximum reliability.
It offers Atotech latest technology package in chemical processing, thin material conveyance and advanced fluid delivery.
Equipment highlights:
- Automatic discharging devices.
- Advanced cascade-rinsing technology with highly efficient and optimized pump circuits.
- Fully automated panel tracking control.
- High level of automation and process control combined with the smart use of production data ready for FAB 4.0.
- Available with analyzer monitoring technology and fully automatic control of dosing system.
- Strong process performance with patented flood bar technology.
Final finishing
The Stannatech? state-of-the-art tin deposition technology sets the world standard in thinnest tin deposition on printed circuit boards, making it one of the few surface finishing systems verified by all major automobile manufacturers. With our unique Crystallizer? and ConStannic? control, the system is perfect for immersion tin for multiple Pb-free soldering and press-fit technology. Stannatech? achieves the highest mileages and process reliability in the market. With more than 130 installed Horizon Stannatech lines we have build up a successful reference base.?
Equipment highlights:
- High level of automation and process control combined with the smart use of production data ready for FAB 4.0.
- ConStannic? and Crystallizer? auxiliary equipment result in extended life time and efficiency of the applied chemistry ¨C no feed and bleed process
- The line is available with hot water heating system.
- Leading transportation system enable parallel transportation of smaller panel pieces.
- Strong process performance with patented flood bar technology.
Service, retrofit and spare parts
At òòò½ÊÓƵ’ Atotech, customer satisfaction is our top priority. From initial interest and product selection to installation and ongoing support, we are committed to delivering high performance products and reliable manufacturing processes. The quality and reliability of our services, as well as every component of the final product, are essential to fulfilling our promise: to provide leading-edge technology and the highest performing system solutions that stand the test of time.
With more than 1,100 production lines in operation worldwide, we have refined our parts and service offerings to meet the diverse needs of our customers. We provide comprehensive services including maintenance, original spare parts and retrofit solutions for our Uniplate?, Horizon?, MultiPlate?, Polygon?, lines, as well as our latest innovations, G-Plate? and vPlate?. We also offer auxiliary equipment to complement our product lines.
- Extended equipment lifespan: maximize the longevity of your equipment with high-quality retrofits and upgrades.
- Reliable spare parts: ensure your systems run smoothly with original spare parts that meet rigorous safety and performance standards.
- Minimized downtime: reduce production interruptions with fast delivery and efficient installation of spare parts.
- Comprehensive support: benefit from expert on-site service and technical assistance tailored to your specific needs.
- Global service reach: access a worldwide network of service and support, ensuring help is available wherever your operations are located.
- Cost-effective solutions: lower your operational costs with long-term service plans and proactive maintenance options.
- Tailored retrofit solutions: adapt your existing systems to meet new technological demands with customized retrofit options.
- Trusted expertise: leverage decades of experience and industry knowledge for high-performance manufacturing solutions.
Featured products
Stannatech LINE?
New generation horizontal immersion tin line for high volume production requirements
PLB line?
New cost-effective plating tool for highly reliable, high-volume PCB production
Uniplate? PLB
Our new innovative plating tool
Uniplate? PLB systems solution is designed for advanced substrates, minimized consumption of energy, water and chemistry and is optimized for a high level of automation, repetitive high-quality production results, as well as the next phase of industrial internet of things (IIOT) and Smart Factory production.
Transportation technology
Universal transport system (UTS) – For ultra flex material processing (UTS-xs)
Our universal transport system is designed to enable our desmear, PTH and copper plating equipment to process a broad range of different panel thicknesses. The universal transport system consists of UTS-XL, UTS-s, UTS-xs and the new UTS-xs+. It is the latest addition to the UTS that opens new possibilities for safe thin material transportation in our Uniplate? P and LB lines.
